Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders
type: Dataset
contact point: Organization
  fn: CCSD
keyword: lanthanum
keyword: journal-articles
keyword: intermetallic-compounds
keyword: spimatengineering-sciences-physicsmaterials
keyword: sac-alloys
keyword: aging-temperature
keyword: spimecamemaengineering-sciences-physicsmechanics-physicsmed-phmechanics-of-materials-phy
keyword: infoeu-reposemanticsarticle
keyword: aging-time
keyword: physmecamemaphysics-physicsmechanics-physicsmechanics-of-materials-physicsclass-ph
landing page: 0361-5235
description: The authors would like to thank Ste'phanie Blanc (Electrical Engineer at Schlumberger) for her useful contribution to the project, Claude Guyomard and Olivier Naegelen (Arts et Me'tiers ParisTech) for the die design and sample casting, respectively, and Jean-Marc Raulot for his enriching discussions.
issued: 2026-05-07T07:23:27.892919
language: en
modified: 2026-05-07T07:23:27.892924

test_moissonnage_selune
type: Agent

Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders
type: Distribution
access URL: https://hal.science/hal-00934931
format: HTML
issued: 2026-05-07T07:23:27.901307
modified: 2026-05-07T07:23:27.878698