The authors would like to thank Ste'phanie Blanc (Electrical Engineer at Schlumberger) for her useful contribution to the project, Claude Guyomard and Olivier Naegelen (Arts et Me'tiers ParisTech) for the die design and sample casting, respectively, and Jean-Marc Raulot for his enriching discussions.
Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders