On modelling the behaviour of a ductile adhesive under low temperatures
type: Distribution
access URL: https://hal.science/hal-00905269
format: HTML
issued: 2026-05-08T05:25:17.164561
modified: 2026-05-08T05:25:17.153559

test_moissonnage_selune
type: Agent

On modelling the behaviour of a ductile adhesive under low temperatures
type: Dataset
contact point: Organization
  fn: CCSD
keyword: thermo-mechanical-loads
keyword: stress-concentration
keyword: adhesively-bonded-joint
keyword: journal-articles
keyword: joint-design
keyword: finite-element-analysis
keyword: infoeu-reposemanticsarticle
landing page: 0143-7496
description: WOS
issued: 2026-05-08T05:25:17.162770
language: en
modified: 2026-05-08T05:25:17.162774