New bonded assembly configuration for dynamic mechanical analysis of adhesives
type: Dataset
description: International audience
issued: 2026-05-10T11:57:24.354579
language: en
modified: 2026-05-10T11:57:24.354584
contact point: Organization
  fn: CCSD
keyword: adhesively-bonded-joint
keyword: bulk-adhesive
keyword: dynamic-mechanical-analysis
keyword: epoxy
keyword: infoeu-reposemanticsarticle
keyword: journal-articles
keyword: molecular-mobility
keyword: spimatengineering-sciences-physicsmaterials
landing page: 0143-7496

New bonded assembly configuration for dynamic mechanical analysis of adhesives
type: Distribution
format: HTML
issued: 2026-05-10T11:57:24.365211
modified: 2026-05-10T11:57:24.345012
access URL: https://hal.science/hal-00840784

test_moissonnage_selune
type: Agent