Silver oxalate-based solders: New materials for high thermal conductivity microjoining
type: Dataset
description: International audience
issued: 2026-05-10T19:18:39.556710
language: en
modified: 2026-05-10T19:18:39.556714
contact point: Organization
  fn: CCSD
keyword: chimmatechemical-sciencesmaterial-chemistry
keyword: infoeu-reposemanticsarticle
keyword: joining
keyword: journal-articles
keyword: microelectronic-packaging
keyword: physmecamsmecaphysics-physicsmechanics-physicsmaterials-and-structures-in-mechanics-physi
keyword: silver-oxalate
keyword: soldering
keyword: spimecamsmecaengineering-sciences-physicsmechanics-physicsmed-phmaterials-and-structures
keyword: thermal-conductivity
landing page: 1359-6462

Silver oxalate-based solders: New materials for high thermal conductivity microjoining
type: Distribution
format: HTML
issued: 2026-05-10T19:18:39.575101
modified: 2026-05-10T19:18:39.545448
access URL: https://hal.science/hal-00832138

test_moissonnage_selune
type: Agent