A novel method to fabricate full-kerfed high-frequency (>100MHz) ultrasonic array transducers
type: Dataset
contact point: Organization
  fn: CCSD
keyword: finite-element-methods
keyword: arrays
keyword: acoustics
keyword: infoeu-reposemanticsconferenceobject
keyword: silicon
keyword: spiengineering-sciences-physics
keyword: conference-papers
keyword: zinc-oxide
keyword: films
landing page: IEEE International Ultrasonics Symposium, IUS 2011
description: High-frequency ultrasonic transducer arrays are essential for efficient imaging in clinical analysis and nondestructive evaluation (NDE). However, the fabrication of piezoelectric transducers is really a great challenge due to the small features in piezoelectric films. This paper describes a novel technique to fabricate thick-film ZnO ultrasonic array transducers. Piezoelectric elements are formed by sputtering thick-film ZnO onto etched features of a silicon substrate so that the difficult etching process for ZnO films is avoided by etching silicon. This process is simple and efficient. A 13-μm-pitch ZnO sandwich array is achieved with a thickness of 8 μm for 300 MHz. Finite element method is employed to calculate its electrical properties, including electrical impedance and crosstalk. The array is characterized by a network analyzer. The measured results are in good agreement with the theoretical predictions.
issued: 2026-05-12T19:11:37.427541
language: en
modified: 2026-05-12T19:11:37.427546

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type: Agent

A novel method to fabricate full-kerfed high-frequency (>100MHz) ultrasonic array transducers
type: Distribution
access URL: https://hal.science/hal-00800465
format: HTML
issued: 2026-05-12T19:11:37.455388
modified: 2026-05-12T19:11:37.407429