On the Dependability of 3D Interconnects
type: Dataset
description: National audience
keyword: conference-papers
keyword: dependability
keyword: infoeu-reposemanticsconferenceobject
keyword: interconnected-processor
keyword: pacs-8542
keyword: spinanoengineering-sciences-physicsmicro-and-nanotechnologiesmicroelectronics
issued: 2026-05-25T13:14:53.802711
modified: 2026-05-25T13:14:53.802718
language: en
contact point: Organization
  fn: CCSD

test_moissonnage_selune
type: Agent

On the Dependability of 3D Interconnects
type: Distribution
format: HTML
access URL: https://hal.science/hal-00677047
issued: 2026-05-25T13:14:53.815211
modified: 2026-05-25T13:14:53.780461