Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites
type: Dataset
description: International audience
issued: 2026-05-27T01:21:00.421587
language: en
modified: 2026-05-27T01:21:00.421594
contact point: Organization
  fn: CCSD
keyword: adhesion
keyword: bond-strength-materials
keyword: chemical-bonds
keyword: copper
keyword: glass-fiber-reinforced-plastics
keyword: infoeu-reposemanticsarticle
keyword: interfaces-materials
keyword: journal-articles
keyword: magnetron-sputtering
keyword: polyamides
keyword: pressure-effects
keyword: spimatengineering-sciences-physicsmaterials
keyword: surface-structure
keyword: tensile-testing
keyword: thermal-effects
landing page: 0267-0844

Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites
type: Distribution
format: HTML
issued: 2026-05-27T01:21:00.611345
modified: 2026-05-27T01:21:00.362613
access URL: https://minesparis-psl.hal.science/hal-00674005

test_moissonnage_selune
type: Agent