@prefix dcat: <http://www.w3.org/ns/dcat#> .
@prefix dct: <http://purl.org/dc/terms/> .
@prefix foaf: <http://xmlns.com/foaf/0.1/> .
@prefix vcard: <http://www.w3.org/2006/vcard/ns#> .
@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .

<https://rec.harvest-normandie.data4citizen.com/dataset/oai-hal-hal-00672244v1> a dcat:Dataset ;
    dct:description "International audience" ;
    dct:identifier "hal-00672244" ;
    dct:issued "2026-05-27T20:34:08.254510"^^xsd:dateTime ;
    dct:language "en" ;
    dct:modified "2026-05-27T20:34:08.254516"^^xsd:dateTime ;
    dct:publisher <https://rec.harvest-normandie.data4citizen.com/organization/cce9db95-46d9-4dc2-84b6-764215d0a002> ;
    dct:title "Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding" ;
    dcat:contactPoint [ a vcard:Organization ;
            vcard:fn "CCSD" ] ;
    dcat:distribution <https://rec.harvest-normandie.data4citizen.com/dataset/oai-hal-hal-00672244v1/resource/4a85b00e-1c98-4add-b9c5-386f5fa884e5> ;
    dcat:keyword "infoeu-reposemanticsarticle",
        "journal-articles",
        "power-electronics",
        "semiconductor-device-packaging",
        "spark-plasma-sintering",
        "spiotherengineering-sciences-physicsother",
        "spitronengineering-sciences-physicselectronics",
        "three-dimensional-packaging" ;
    dcat:landingPage <ISSN:%201521-3331> .

<ISSN:%201521-3331> a foaf:Document .

<https://rec.harvest-normandie.data4citizen.com/dataset/oai-hal-hal-00672244v1/resource/4a85b00e-1c98-4add-b9c5-386f5fa884e5> a dcat:Distribution ;
    dct:format "HTML" ;
    dct:issued "2026-05-27T20:34:08.259634"^^xsd:dateTime ;
    dct:modified "2026-05-27T20:34:08.228591"^^xsd:dateTime ;
    dct:title "Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding" ;
    dcat:accessURL <https://hal.science/hal-00672244> .

<https://rec.harvest-normandie.data4citizen.com/organization/cce9db95-46d9-4dc2-84b6-764215d0a002> a foaf:Agent ;
    foaf:name "test_moissonnage_selune" .

