Reliabilty in mechatronic systems from TEM , SEM and SE material analysis
type: Dataset
description: Mechatronic systems designed to comply to new EU directives are studied through interconnections by electronic or photonic probes, SEM, TEM, SE or 3D Tomography. Leaded and lead free modules assembled by standard interconnection technologies are studied for robustness relative to thermal accelerated life tests. Results obtained from JEOL 6060LV SEM and Optical Microscopy show that although slow growth rate of inter-metallics (IMC) is consistent with expected reliability, they are responsible for propagation of cracks especially in the presence of gold on PCB side. Innovative Low Temperature Joining (LTJ) technology applied to nano or micro silver pastes which should reduce IMC effects are tested on mechatronic systems. Results obtained from SEM, TEM and 3D Tomography will be shown as well as non destructive Spectroscopic Ellipsometry studies of samples. Pressureless LTJ technology is unsuitable for robust interconnection.
issued: 2026-05-28T02:10:01.561326
language: en
modified: 2026-05-28T02:10:01.561335
contact point: Organization
  fn: CCSD
keyword: conference-papers
keyword: infoeu-reposemanticsconferenceobject
keyword: scanning-electron-microscopy
keyword: sem
keyword: sintering
keyword: spimatengineering-sciences-physicsmaterials
keyword: thermal-stresses

Reliabilty in mechatronic systems from TEM , SEM and SE material analysis
type: Distribution
format: HTML
issued: 2026-05-28T02:10:01.615627
modified: 2026-05-28T02:10:01.513989
access URL: https://hal.science/hal-00671699

test_moissonnage_selune
type: Agent