Effect of Au and Ni layer thicknesses on the reliability of BGA solder joints
type: Dataset
description: ISBN: 1-4244-0107-0
landing page: Proc. of Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on
keyword: ageing
keyword: ball-grid-arrays
keyword: conference-papers
keyword: copper-alloys
keyword: fracture-toughness
keyword: gold-alloys
keyword: infoeu-reposemanticsconferenceobject
keyword: integrated-circuit-reliability
keyword: lead-alloys
keyword: nickel-alloys
keyword: pacs-8542
keyword: scanning-electron-microscopy-solders
keyword: spinanoengineering-sciences-physicsmicro-and-nanotechnologiesmicroelectronics
keyword: surface-diffusion--tin-alloys
keyword: x-ray-chemical-analysis
issued: 2026-05-14T09:29:29.543820
modified: 2026-05-14T09:29:29.543829
language: en
contact point: Organization
  fn: CCSD

test_moissonnage_selune
type: Agent

Effect of Au and Ni layer thicknesses on the reliability of BGA solder joints
type: Distribution
format: HTML
access URL: https://hal.science/hal-00079018
issued: 2026-05-14T09:29:29.600475
modified: 2026-05-14T09:29:29.498781