@prefix dcat: <http://www.w3.org/ns/dcat#> .
@prefix dct: <http://purl.org/dc/terms/> .
@prefix foaf: <http://xmlns.com/foaf/0.1/> .
@prefix vcard: <http://www.w3.org/2006/vcard/ns#> .
@prefix xsd: <http://www.w3.org/2001/XMLSchema#> .

<https://rec.harvest-normandie.data4citizen.com/dataset/oai-hal-hal-00079018v1> a dcat:Dataset ;
    dct:description "ISBN: 1-4244-0107-0" ;
    dct:identifier "hal-00079018" ;
    dct:issued "2026-05-14T09:29:29.543820"^^xsd:dateTime ;
    dct:language "en" ;
    dct:modified "2026-05-14T09:29:29.543829"^^xsd:dateTime ;
    dct:publisher <https://rec.harvest-normandie.data4citizen.com/organization/cce9db95-46d9-4dc2-84b6-764215d0a002> ;
    dct:title "Effect of Au and Ni layer thicknesses on the reliability of BGA solder joints" ;
    dcat:contactPoint [ a vcard:Organization ;
            vcard:fn "CCSD" ] ;
    dcat:distribution <https://rec.harvest-normandie.data4citizen.com/dataset/oai-hal-hal-00079018v1/resource/3b21bfa7-e8c1-45bb-94ca-8b671bd7c863> ;
    dcat:keyword "ageing",
        "ball-grid-arrays",
        "conference-papers",
        "copper-alloys",
        "fracture-toughness",
        "gold-alloys",
        "infoeu-reposemanticsconferenceobject",
        "integrated-circuit-reliability",
        "lead-alloys",
        "nickel-alloys",
        "pacs-8542",
        "scanning-electron-microscopy-solders",
        "spinanoengineering-sciences-physicsmicro-and-nanotechnologiesmicroelectronics",
        "surface-diffusion--tin-alloys",
        "x-ray-chemical-analysis" ;
    dcat:landingPage <Proc.%20of%20Electronics%20Materials%20and%20Packaging%2C%202005.%20EMAP%202005.%20International%20Symposium%20on> .

<Proc.%20of%20Electronics%20Materials%20and%20Packaging%2C%202005.%20EMAP%202005.%20International%20Symposium%20on> a foaf:Document .

<https://rec.harvest-normandie.data4citizen.com/dataset/oai-hal-hal-00079018v1/resource/3b21bfa7-e8c1-45bb-94ca-8b671bd7c863> a dcat:Distribution ;
    dct:format "HTML" ;
    dct:issued "2026-05-14T09:29:29.600475"^^xsd:dateTime ;
    dct:modified "2026-05-14T09:29:29.498781"^^xsd:dateTime ;
    dct:title "Effect of Au and Ni layer thicknesses on the reliability of BGA solder joints" ;
    dcat:accessURL <https://hal.science/hal-00079018> .

<https://rec.harvest-normandie.data4citizen.com/organization/cce9db95-46d9-4dc2-84b6-764215d0a002> a foaf:Agent ;
    foaf:name "test_moissonnage_selune" .

