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Study of resistivity and electromigration behaviour in interconnections inten...
The resistivity and reliability of copper in interconnections of the integrated circuits for the 90 nm - 32 nm nodes were studied. The context, the processing of the... -
Microstructuring inkjet-printed deposits from silver nanoparticules coalescen...
Several challenges are still holding back the technological transfer of printed electronics to industry in spite of recent progresses. In this thesis work, the... -
Interconnection of logistics networks : elements of definition and potential
Logistics networks intensely use transportation means and storage facilities to respond to supply chain's demands. However, these networks are overwhelmingly... -
Lyon, nœud de communication européen
Expertise réalisée pour le compte de l'Agence d'Urbanisme de la Communauté Urbaine de Lyon sous la responsabilité scientifique de François Plassard -
Timing consideration for electronic device description
Rapport interne.
