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De-embedding response of filters from diplexer measurements
International audience -
Characterization and modelling of 3D inteconnects HF performance for new gene...
The aim of this doctoral work is to study the new kind of interconnections like TSV (Through Silicon Via), redistribution lines (RDL) and copper pillars used in 3D... -
Benefits and validation of 4-dummies de-embedding method for characterization...
By taking into account the transistor parasitic lumped elements originated from the contact pads and the metal interconnections including the top-down connection, an...
