-
Characterization and modelling of 3D inteconnects HF performance for new gene...
The aim of this doctoral work is to study the new kind of interconnections like TSV (Through Silicon Via), redistribution lines (RDL) and copper pillars used in 3D... -
Control of the frequency of the electromechanical resonators MEMS
Present, Micro-Electro-Mechanical-Systems (MEMS) have become essential ineveryday technology products. Thanks to their size, performances andintegration, resonant...
