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Characterization and modelling of 3D inteconnects HF performance for new gene...
The aim of this doctoral work is to study the new kind of interconnections like TSV (Through Silicon Via), redistribution lines (RDL) and copper pillars used in 3D... -
A 3D IC BIST for pre-bond test of TSVs using Ring Oscillators
International audience -
ASIC Design Methodologies for 3D NOC Based 3D Heterogeneous Multiprocessor on...
In this thesis, we study the exploration 3D NoC architectures through physical design implementations using real 3D technology used in the industry. Based on the...
